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Product characteristics:

Ceramic Filling/Teflon Microwave Composites

Minimum insertion loss at the same level

The lowest dielectric loss of the same level

Electron phase stabilization for temperature change

High thermal conductivity

Minimum dielectric constant tolerance (+0.02) and thickness tolerance

Product advantages:

Excellent thermal stability of Dk/Df

Phase stability with temperature

High dimensional stability, suitable for complex design of multi-layer microwave board

Excellent expansion coefficients of x, y, z axes

Typical applications:

Microwave/Radio Frequency Defense Electronic Applications


- Array antenna

Microwave feeder network

CNI (Communications, Navigation and Recognition) Applications

Communications and Intelligence Systems, Satellites & Space Electronics

High-frequency and high-speed electronic applications